Invention Grant
US08097488B2 Method for forming pattern, method for manufacturing semiconductor apparatus, and method for manufacturing display
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形成图案的方法，半导体装置的制造方法以及显示器的制造方法
- Patent Title: Method for forming pattern, method for manufacturing semiconductor apparatus, and method for manufacturing display
- Patent Title (中): 形成图案的方法，半导体装置的制造方法以及显示器的制造方法
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Application No.: US12465249Application Date: 2009-05-13
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Publication No.: US08097488B2Publication Date: 2012-01-17
- Inventor: Noriyuki Kawashima
- Applicant: Noriyuki Kawashima
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2008-126820 20080514
- Main IPC: H01L51/40
- IPC: H01L51/40
Abstract:
A method for forming a pattern includes the steps of forming a resin pattern through printing on a substrate, forming a water-repellent pattern in such a way that an opening bottom of the resin pattern is covered with a fluorine based material by feeding the fluorine based material from the top of the resin pattern, forming an open window in the water-repellent pattern by removing the resin pattern, and forming a desired pattern composed of a pattern-forming material by feeding the pattern-forming material into the open window of the water-repellent pattern.
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Information query
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