Invention Grant
US08097494B2 Method of making an integrated circuit package with shielding via ring structure
有权
通过环形结构制造具有屏蔽的集成电路封装的方法
- Patent Title: Method of making an integrated circuit package with shielding via ring structure
- Patent Title (中): 通过环形结构制造具有屏蔽的集成电路封装的方法
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Application No.: US12688580Application Date: 2010-01-15
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Publication No.: US08097494B2Publication Date: 2012-01-17
- Inventor: Jinbang Tang , Darrel Frear , Jong-Kai Lin , Marc A. Mangrum , Robert E. Booth , Lawrence N. Herr , Kenneth R. Burch
- Applicant: Jinbang Tang , Darrel Frear , Jong-Kai Lin , Marc A. Mangrum , Robert E. Booth , Lawrence N. Herr , Kenneth R. Burch
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent David G. Dolezal
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.
Public/Granted literature
- US20110003435A1 ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE Public/Granted day:2011-01-06
Information query
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