Invention Grant
US08097509B2 Method for manufacturing semiconductor device with a recessed channel
有权
用于制造具有凹槽的半导体器件的方法
- Patent Title: Method for manufacturing semiconductor device with a recessed channel
- Patent Title (中): 用于制造具有凹槽的半导体器件的方法
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Application No.: US12839075Application Date: 2010-07-19
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Publication No.: US08097509B2Publication Date: 2012-01-17
- Inventor: Jin Yul Lee
- Applicant: Jin Yul Lee
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc,
- Current Assignee: Hynix Semiconductor Inc,
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2007-0127859 20071210
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device having a recessed channel and a method for manufacturing the same. The semiconductor device comprises a semiconductor substrate formed with an isolation layer defining an active region including a channel region and a junction region, a recessed trench including a top trench formed within the channel region of the semiconductor substrate and a bottom trench formed from a bottom surface of the top trench with a width narrower than the top trench, and a gate stack overlapping the recessed trench and extending across the active region.
Public/Granted literature
- US20100279497A1 Method for Manufacturing Semiconductor Device with a Recessed Channel Public/Granted day:2010-11-04
Information query
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