Invention Grant
- Patent Title: Semiconductor device having P-N column layer and method for manufacturing the same
- Patent Title (中): 具有P-N柱层的半导体器件及其制造方法
-
Application No.: US12155485Application Date: 2008-06-05
-
Publication No.: US08097511B2Publication Date: 2012-01-17
- Inventor: Takumi Shibata , Shouichi Yamauchi , Syouji Nogami , Tomonori Yamaoka
- Applicant: Takumi Shibata , Shouichi Yamauchi , Syouji Nogami , Tomonori Yamaoka
- Applicant Address: JP Kariya JP Tokyo
- Assignee: Denso Corporation,Sumco Corporation
- Current Assignee: Denso Corporation,Sumco Corporation
- Current Assignee Address: JP Kariya JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2007-150889 20070606
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device is provided, which includes a substrate; a P-N column layer disposed on the substrate; a second conductivity type epitaxial layer disposed on the P-N column layer. The P-N column layer includes first conductivity type columns and second conductivity type columns, which are alternately arranged. Each column has a tapered shape. A portion of the first conductivity type column located around the substrate has a smaller impurity concentration than another portion of the first conductivity type column located around the second conductivity type epitaxial layer. A portion of the second conductivity type column located around the substrate has a larger impurity concentration than another portion of the first conductivity type column located around the second conductivity type epitaxial layer.
Public/Granted literature
- US20080303114A1 Semiconductor device having P-N column layer and method for manufacturing the same Public/Granted day:2008-12-11
Information query
IPC分类: