Invention Grant
- Patent Title: Method for manufacturing a semiconductor light emitting device
- Patent Title (中): 半导体发光元件的制造方法
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Application No.: US12086174Application Date: 2006-12-04
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Publication No.: US08097532B2Publication Date: 2012-01-17
- Inventor: Yukio Shakuda
- Applicant: Yukio Shakuda
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JPP2005-355299 20051208
- International Application: PCT/JP2006/324152 WO 20061204
- International Announcement: WO2007/066605 WO 20070614
- Main IPC: H01L21/28
- IPC: H01L21/28

Abstract:
To provide a method for manufacturing a semiconductor light emitting device capable of providing sufficiently low operating voltage.The method for manufacturing a semiconductor light emitting device of the present invention includes: a semiconductor laminating step of laminating a plurality of nitride semiconductor layers of to form a semiconductor laminating structure; and an electrode forming step of forming n-side electrode and p-side electrodes on the n-type and p-type semiconductor layers. In the electrode forming step, after a first metallic layer including a Ni layer constituting a part of the n-side electrode is formed on a surface of a forming region of the n-side electrode, the first metallic layer is annealed in an atmosphere containing nitrogen and oxygen.
Public/Granted literature
- US20090305448A1 Method for Manufacturing a Semiconductor Light Emitting Device Public/Granted day:2009-12-10
Information query
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