Invention Grant
US08097532B2 Method for manufacturing a semiconductor light emitting device 有权
半导体发光元件的制造方法

  • Patent Title: Method for manufacturing a semiconductor light emitting device
  • Patent Title (中): 半导体发光元件的制造方法
  • Application No.: US12086174
    Application Date: 2006-12-04
  • Publication No.: US08097532B2
    Publication Date: 2012-01-17
  • Inventor: Yukio Shakuda
  • Applicant: Yukio Shakuda
  • Applicant Address: JP Kyoto
  • Assignee: Rohm Co., Ltd.
  • Current Assignee: Rohm Co., Ltd.
  • Current Assignee Address: JP Kyoto
  • Agency: Rabin & Berdo, P.C.
  • Priority: JPP2005-355299 20051208
  • International Application: PCT/JP2006/324152 WO 20061204
  • International Announcement: WO2007/066605 WO 20070614
  • Main IPC: H01L21/28
  • IPC: H01L21/28
Method for manufacturing a semiconductor light emitting device
Abstract:
To provide a method for manufacturing a semiconductor light emitting device capable of providing sufficiently low operating voltage.The method for manufacturing a semiconductor light emitting device of the present invention includes: a semiconductor laminating step of laminating a plurality of nitride semiconductor layers of to form a semiconductor laminating structure; and an electrode forming step of forming n-side electrode and p-side electrodes on the n-type and p-type semiconductor layers. In the electrode forming step, after a first metallic layer including a Ni layer constituting a part of the n-side electrode is formed on a surface of a forming region of the n-side electrode, the first metallic layer is annealed in an atmosphere containing nitrogen and oxygen.
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