A method for soldering or hybridizing two components including preparing, on opposing surfaces of the components to be welded or hybridized, a wettability surface, depositing on one of the wettability surfaces an appropriate quantity of solder material, constituting a soldering or hybridizing dot, contacting the wettability surfaces of the components with the solder material deposited, then raising the temperature of the chamber in which the components are positioned, to at least the melting point of the solder material in order to ensure the effective soldering or hybridizing of the two components together by a remelt effect. At least one of the components is in contact with a conducting track having another quantity of solder material that constitutes a sacrificial dot, having a contact area with the at least one component that is higher than that of the solder quantity that constitutes the soldering or hybridizing dot.