Invention Grant
US08097830B2 Method for material processing and/or material analysis using lasers
有权
使用激光的材料加工和/或材料分析方法
- Patent Title: Method for material processing and/or material analysis using lasers
- Patent Title (中): 使用激光的材料加工和/或材料分析方法
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Application No.: US10508662Application Date: 2003-02-28
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Publication No.: US08097830B2Publication Date: 2012-01-17
- Inventor: Ludger Wöeste , Jean-Pierre Wolf
- Applicant: Ludger Wöeste , Jean-Pierre Wolf
- Applicant Address: DE Berlin
- Assignee: Freie Universitaet Berlin
- Current Assignee: Freie Universitaet Berlin
- Current Assignee Address: DE Berlin
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: DE10213044 20020322
- International Application: PCT/EP03/02074 WO 20030228
- International Announcement: WO03/080284 WO 20031002
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
The invention relates to a method for material processing and/or material analysis of an object (18) made from condensed matter by means of a laser (12). A laser pulse (14) is generated by a laser, emitted in the direction of the object. The laser pulse is spatially and temporally focussed such as to give a peak power for the laser pulse at a point between the laser and the object which exceeds the critical power for a self-focussing effect of the laser pulse. The laser pulse thus forms a filament (88) of high power density. The filament (88) is directed at the object and generates an aggregation state change there (evaporation or plasma formation) for a part of the material of the object. The method can be applied to both material processing (cutting, drilling, welding, hardening) and material analysis (analysis of the plasma light).
Public/Granted literature
- US20050127049A1 Method for material processing and/or material analysis using lasers Public/Granted day:2005-06-16
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