Invention Grant
- Patent Title: Light emitting diode
- Patent Title (中): 发光二极管
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Application No.: US12566898Application Date: 2009-09-25
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Publication No.: US08097899B2Publication Date: 2012-01-17
- Inventor: Chia-Hao Wu , Shun-Chung Cheng
- Applicant: Chia-Hao Wu , Shun-Chung Cheng
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corporation
- Current Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corporation
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Li&Cai Intellectual Property (USA) Office
- Priority: CN200910039912 20090528
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting diode of the present invention comprises a support frame, a shell, a light emitting diode chip and an encapsulating body. The shell is used to accommodate the support frame. The shell has a bowl-shaped structure and the bowl-shaped structure has two opposite first walls and two opposite second walls. The upper edge of the second wall is a concave-convex structure. The encapsulating body is used to package the bowl-shaped structure and the encapsulating body has a concave-convex structure similar to the concave-convex structure of the bowl-shaped structure. The concave-convex structure comprises a concave portion and a convex portion. The structure of the light emitting diode is simplified. The luminous intensity and the light extraction efficiency of the light emitting diode are enhanced and the thickness of the light emitting diode is not increased.
Public/Granted literature
- US20100301361A1 LIGHT EMITTING DIODE Public/Granted day:2010-12-02
Information query
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