Invention Grant
- Patent Title: Electronics device package and fabrication method thereof
- Patent Title (中): 电子器件封装及其制造方法
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Application No.: US12398946Application Date: 2009-03-05
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Publication No.: US08097929B2Publication Date: 2012-01-17
- Inventor: Chia-Sheng Lin , Yu-Ting Huang , Chih-Lung Lai
- Applicant: Chia-Sheng Lin , Yu-Ting Huang , Chih-Lung Lai
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.
Public/Granted literature
- US20090289318A1 ELECTRONICS DEVICE PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2009-11-26
Information query
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