Invention Grant
- Patent Title: Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component
- Patent Title (中): 部件，功率部件，装置，部件的制造方法以及功率半导体部件的制造方法
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Application No.: US11685321Application Date: 2007-03-13
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Publication No.: US08097936B2Publication Date: 2012-01-17
- Inventor: Henrik Ewe , Joachim Mahler
- Applicant: Henrik Ewe , Joachim Mahler
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Banner & Witcoff, Ltd.
- Priority: DE102007009521 20070227
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A component has a device applied to a device carrier, a first conducting layer grown onto the device and onto the device carrier, and an insulating material applied to the first conducting layer such that only a portion of the first conducting layer is covered.
Public/Granted literature
Information query
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