Invention Grant
US08097937B2 Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
有权
用于辐射发射部件的引线框和壳体，辐射发射部件以及用于制造部件的方法
- Patent Title: Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
- Patent Title (中): 用于辐射发射部件的引线框和壳体，辐射发射部件以及用于制造部件的方法
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Application No.: US10683712Application Date: 2003-10-10
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Publication No.: US08097937B2Publication Date: 2012-01-17
- Inventor: Georg Bogner , Herbert Brunner , Michael Hiegler , Günter Waitl
- Applicant: Georg Bogner , Herbert Brunner , Michael Hiegler , Günter Waitl
- Applicant Address: DE Munich
- Assignee: OSRAM AG
- Current Assignee: OSRAM AG
- Current Assignee Address: DE Munich
- Agency: Fish & Richardson P.C.
- Priority: DE10117889 20010410
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L23/495
Abstract:
A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.
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Information query
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