Invention Grant
- Patent Title: Conductive chip-scale package
- Patent Title (中): 导电芯片级封装
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Application No.: US12405577Application Date: 2009-03-17
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Publication No.: US08097938B2Publication Date: 2012-01-17
- Inventor: Martin Standing , Robert J Clarke
- Applicant: Martin Standing , Robert J Clarke
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
Public/Granted literature
- US20090174058A1 CHIP SCALE PACKAGE Public/Granted day:2009-07-09
Information query
IPC分类:
