Invention Grant
- Patent Title: Device mounting board, semiconductor module, and mobile device
- Patent Title (中): 设备安装板，半导体模块和移动设备
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Application No.: US12263174Application Date: 2008-10-31
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Publication No.: US08097946B2Publication Date: 2012-01-17
- Inventor: Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
- Applicant: Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-284470 20071031; JP2008-272393 20081022
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/12
Abstract:
A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode 14 of the device mounting board 10 with high precision.
Public/Granted literature
- US20090115056A1 DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, AND MOBILE DEVICE Public/Granted day:2009-05-07
Information query
IPC分类:
