Invention Grant
- Patent Title: Semiconductor mounting bonding wire
- Patent Title (中): 半导体安装接合线
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Application No.: US12146792Application Date: 2008-06-26
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Publication No.: US08097960B2Publication Date: 2012-01-17
- Inventor: Shinichi Terashima , Tomohiro Uno , Kohei Tatsumi , Takashi Yamada , Atsuo Ikeda , Daizo Oda
- Applicant: Shinichi Terashima , Tomohiro Uno , Kohei Tatsumi , Takashi Yamada , Atsuo Ikeda , Daizo Oda
- Applicant Address: JP Tokyo JP Iruma
- Assignee: Nippon Steel Materials Co., Ltd,Nippon Micrometal Corporation
- Current Assignee: Nippon Steel Materials Co., Ltd,Nippon Micrometal Corporation
- Current Assignee Address: JP Tokyo JP Iruma
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-170613 20070628; JP2008-163617 20080623
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
There is provided a bonding wire which does not cause a leaning failure or the like. A semiconductor mounting bonding wire has a breaking elongation of 7 to 20%, and stress at 1% elongation is greater than or equal to 90% of a tensile strength and is less than or equal to 100% thereof.
Public/Granted literature
- US20090072399A1 SEMICONDUCTOR MOUNTING BONDING WIRE Public/Granted day:2009-03-19
Information query
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