Invention Grant
- Patent Title: Semiconductor device having a simplified stack and method for manufacturing thereof
- Patent Title (中): 具有简化堆叠的半导体器件及其制造方法
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Application No.: US12341863Application Date: 2008-12-22
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Publication No.: US08097961B2Publication Date: 2012-01-17
- Inventor: Junji Tanaka , Koji Taya , Masahiko Harayama
- Applicant: Junji Tanaka , Koji Taya , Masahiko Harayama
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Priority: JP2007-331183 20071221
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.
Public/Granted literature
- US20090321958A1 SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2009-12-31
Information query
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