Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12372130Application Date: 2009-02-17
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Publication No.: US08097962B2Publication Date: 2012-01-17
- Inventor: Kouji Oomori
- Applicant: Kouji Oomori
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-123505 20080509; JP2009-008178 20090116
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor device includes a substrate having external connection terminals, and a semiconductor chip mounted over a semiconductor-chip mounting portion of the substrate. The external connection terminals are formed by sequentially forming an electroless nickel plating layer, an electroless gold plating layer, and an electrolytic gold plating layer on a terminal portion formed on a surface of the substrate.
Public/Granted literature
- US20090278255A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-11-12
Information query
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