Invention Grant
- Patent Title: Component with reduced temperature response, and method for production
- Patent Title (中): 降低温度响应的组分和生产方法
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Application No.: US12700446Application Date: 2010-02-04
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Publication No.: US08098001B2Publication Date: 2012-01-17
- Inventor: Wolfgang Pahl , Hans Krueger , Werner Ruile
- Applicant: Wolfgang Pahl , Hans Krueger , Werner Ruile
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102007037502 20070808
- Main IPC: H01L41/08
- IPC: H01L41/08
Abstract:
A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.
Public/Granted literature
- US20100187949A1 Component with Reduced Temperature Response, and Method for Production Public/Granted day:2010-07-29
Information query
IPC分类:
