Invention Grant
US08098351B2 Self-planarized passivation dielectric for liquid crystal on silicon structure and related method 有权
用于硅晶体结构的自平面钝化电介质及相关方法

  • Patent Title: Self-planarized passivation dielectric for liquid crystal on silicon structure and related method
  • Patent Title (中): 用于硅晶体结构的自平面钝化电介质及相关方法
  • Application No.: US12157881
    Application Date: 2008-06-13
  • Publication No.: US08098351B2
    Publication Date: 2012-01-17
  • Inventor: Arjun Kar-Roy
  • Applicant: Arjun Kar-Roy
  • Applicant Address: US CA Newport Beach
  • Assignee: Newport Fab, LLC
  • Current Assignee: Newport Fab, LLC
  • Current Assignee Address: US CA Newport Beach
  • Agency: Farjami & Farjami LLP
  • Main IPC: G02F1/1333
  • IPC: G02F1/1333
Self-planarized passivation dielectric for liquid crystal on silicon structure and related method
Abstract:
According to an exemplary embodiment, a liquid crystal on silicon (LCoS) structure includes a number of pixel electrodes overlying an interlayer dielectric, where diagonally adjacent pixel electrodes are separated by a gap. The LCoS structure further includes a self-planarizing passivation dielectric situated over the pixel electrodes and in the gap, where the self-planarizing passivation dielectric has a selected thickness. The self-planarizing passivation dielectric can be an Oxide-Nitride-Oxide (ONO) stack. The selected thickness of the self-planarizing passivation dielectric causes the self-planarizing passivation dielectric to have a substantially planar top surface. In one embodiment, the thickness of the self-planarizing passivation dielectric can be approximately equal to twice a width of the gap.
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