Invention Grant
- Patent Title: Integrated circuit arrangement and circuit array
- Patent Title (中): 集成电路布置和电路阵列
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Application No.: US11574066Application Date: 2005-08-09
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Publication No.: US08098471B2Publication Date: 2012-01-17
- Inventor: Christoph Kienmayer , Martin Streibl , Marc Tiebout
- Applicant: Christoph Kienmayer , Martin Streibl , Marc Tiebout
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102004040973 20040824
- International Application: PCT/DE2005/001405 WO 20050809
- International Announcement: WO2006/021181 WO 20060302
- Main IPC: H02H3/22
- IPC: H02H3/22

Abstract:
One aspect is an integrated circuit arrangement. The arrangement includes a first terminal, which can be brought to a first supply potential, a second terminal, which can be brought to a second supply potential, and a supply potential path formed between the first terminal and the second terminal. There is an electrostatic discharge element at least in the supply potential path. There is a signal input pad, to which an input signal can be applied and a signal output, at an output signal can be provided. A first inductance is arranged between the signal input pad and the signal output, and a second inductance is arranged between the signal output and the first terminal.
Public/Granted literature
- US20080055803A1 INTEGRATED CIRCUIT ARRANGEMENT AND CIRCUIT ARRAY Public/Granted day:2008-03-06
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