Invention Grant
- Patent Title: Data processing modules and systems
- Patent Title (中): 数据处理模块和系统
-
Application No.: US12263374Application Date: 2008-10-31
-
Publication No.: US08098492B2Publication Date: 2012-01-17
- Inventor: Paul Rosenberg , Sagi Mathai , Michael Tan
- Applicant: Paul Rosenberg , Sagi Mathai , Michael Tan
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K1/14
- IPC: H05K1/14
Abstract:
Data processing modules including a housing and connectors carried by the housing, and systems including the same.
Public/Granted literature
- US20090244855A1 Data Processing Modules And Systems Public/Granted day:2009-10-01
Information query
