Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method thereof
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US12649822Application Date: 2009-12-30
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Publication No.: US08098527B2Publication Date: 2012-01-17
- Inventor: Koichi Fukuda , Dai Nakamura , Yasuhiko Matsunaga
- Applicant: Koichi Fukuda , Dai Nakamura , Yasuhiko Matsunaga
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-005778 20090114
- Main IPC: G11C11/34
- IPC: G11C11/34

Abstract:
A semiconductor memory device includes a semiconductor substrate; a memory cell array on the semiconductor substrate, the memory cell array comprising a plurality of memory cells capable of electrically storing data; a sense amplifier configured to detect the data stored in at least one of the memory cells; a cell source driver electrically connected to source side terminals of the memory cells and configured to supply a source potential to at least one of the source side terminals of the memory cells; a first wiring configured to electrically connect between at least one of the source side terminals of the memory cells and the cell source driver; and a second wiring formed in a same wiring layer as the first wiring, the second wiring being insulated from the first wiring and being electrically connected to the sense amplifier, wherein the first wiring and the second wiring have a plurality of through holes provided at a predetermined interval.
Public/Granted literature
- US20100176422A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-07-15
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