Invention Grant
- Patent Title: Multi-level interconnection network
- Patent Title (中): 多层互联网络
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Application No.: US12113120Application Date: 2008-04-30
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Publication No.: US08098593B2Publication Date: 2012-01-17
- Inventor: Chuanxiong Guo , Songwu Lu , Shi Lei , Kun Tan , Haitao Wu , Yongguang Zhang
- Applicant: Chuanxiong Guo , Songwu Lu , Shi Lei , Kun Tan , Haitao Wu , Yongguang Zhang
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agency: Perkins Coie LLP
- Main IPC: H04L12/28
- IPC: H04L12/28 ; G06F15/16

Abstract:
A method and system for providing a multi-level interconnection network is provided. A multi-level interconnection network comprises basic cells that are aggregated into higher level cells at each level of the network. At the first level, the basic cells are aggregated into first level cells. Each first level cell is an aggregation of a number of basic cells that is one more than the number of devices in a basic cell. The basic cells of a first level cell are fully connected; that is, each basic cell has a first level link or connection to each other basic cell. In a first level cell, each device of a basic cell has a first level link to each other basic cell. The multi-level interconnection network has higher level cells that are aggregations of lower level cells in a similar manner.
Public/Granted literature
- US20090274043A1 MULTI-LEVEL INTERCONNECTION NETWORK Public/Granted day:2009-11-05
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