In an example embodiment, an EDA program receives input which includes a selection as to an FPGA die and its device package and a selection as to a structured ASIC die and its device package. If the I/O pins on the device package for the FPGA differ from the I/O pins on the device package for the structured ASIC, the EDA program determines a correspondence between the I/O pins on the two device packages (e.g., by identifying the location of the pads for I/O pins on the structured ASIC die and/or creating a virtual structured ASIC device package whose I/O pins are a superset of the I/O pins on the selected structured ASIC device package), which determination includes checking rules for resource assignments. The EDA program then stores the determined correspondence in a device database where the determined correspondence can be accessed by CAD algorithms.