Invention Grant
- Patent Title: Software product for semiconductor device design
- Patent Title (中): 半导体器件设计软件产品
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Application No.: US12213412Application Date: 2008-06-19
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Publication No.: US08099706B2Publication Date: 2012-01-17
- Inventor: Kenta Yamada
- Applicant: Kenta Yamada
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2005-024557 20050131
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A software product including codes for the method of determining parasitic resistance and capacitance from a layout of an LSI is executed by a computer. The method is achieved by providing a plurality of patterns of a wiring structure which contains a target interconnection; and by producing a library configured to store parameters indicating the parasitic resistance and the parasitic capacitance in relation to the target interconnection to each of the plurality of patterns. The producing is achieved by calculating the parameters to a plurality of conditions corresponding to deviation in manufacture of the wiring structure for each of the plurality of patterns.
Public/Granted literature
- US20080263495A1 Software product for semiconductor device design Public/Granted day:2008-10-23
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