Invention Grant
- Patent Title: Socket assembly for fixing an IC on a circuit plate
- Patent Title (中): 用于将IC固定在电路板上的插座组件
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Application No.: US12949824Application Date: 2010-11-19
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Publication No.: US08105093B2Publication Date: 2012-01-31
- Inventor: Xue-Feng Zhang , Feng-Hao Ku , Yu-Feng Xia
- Applicant: Xue-Feng Zhang , Feng-Hao Ku , Yu-Feng Xia
- Applicant Address: CN Shenzhen, Guangdong Province TW Miao-Li County
- Assignee: Innocom Technology (Shenzhen) Co., Ltd.,Chimei Innolux Corporation
- Current Assignee: Innocom Technology (Shenzhen) Co., Ltd.,Chimei Innolux Corporation
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Miao-Li County
- Agency: Altis Law Group, Inc.
- Priority: CN200910310145 20091120
- Main IPC: H01R12/01
- IPC: H01R12/01

Abstract:
An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion. Wherein when the IC is attached to the socket, the first buckling portion and the second buckling portion are initially disengaged from each other, pins of the IC is electrically connected with the electric portions, the first buckling portion and the second buckling portion are brought together with the elastic connecting portions elastically deforming, and the first buckling portion and the second buckling portion are locked together and hold the IC in the socket.
Public/Granted literature
- US20110124208A1 SOCKET ASSEMBLY FOR FIXING AN IC ON A CIRCUIT PLATE Public/Granted day:2011-05-26
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