Invention Grant
- Patent Title: Manufacturing method of printed circuit board
- Patent Title (中): 印刷电路板的制造方法
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Application No.: US12043460Application Date: 2008-03-06
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Publication No.: US08105644B2Publication Date: 2012-01-31
- Inventor: Takahiko Yokai
- Applicant: Takahiko Yokai
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Main IPC: B05D5/12
- IPC: B05D5/12 ; B05D5/00
Abstract:
A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate.
Public/Granted literature
- US20080217383A1 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD Public/Granted day:2008-09-11
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