Invention Grant
- Patent Title: Substrate inspection apparatus
- Patent Title (中): 基板检查装置
-
Application No.: US12868522Application Date: 2010-08-25
-
Publication No.: US08106672B2Publication Date: 2012-01-31
- Inventor: Kiyoharu Kurosawa
- Applicant: Kiyoharu Kurosawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2009-201038 20090831
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/067 ; G01R31/26

Abstract:
According to one embodiment, a substrate inspection apparatus includes a probe socket, a probe pin, and an adaptor. The probe socket is fixed to an inspection jig on which a substrate is provided, one end of the probe socket being connected to a processor. The probe pin is attached to the other end portion of the probe socket, includes a tip shape conforming to an inspection point of the substrate with which the probe pin is in contact, and including at least one of a projection and a groove designed to specify the tip shape on a side on which the probe pin is attached to the probe socket. The adaptor is attached to the other end portion of the probe socket, and including a through hole formed in conformity with the shape of the side on which the probe pin is attached to the probe socket.
Public/Granted literature
- US20110050264A1 SUBSTRATE INSPECTION APPARATUS Public/Granted day:2011-03-03
Information query