Invention Grant
- Patent Title: Circuit board and telephone apparatus
- Patent Title (中): 电路板和电话设备
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Application No.: US12289233Application Date: 2008-10-23
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Publication No.: US08106831B2Publication Date: 2012-01-31
- Inventor: Katsuhiro Sato
- Applicant: Katsuhiro Sato
- Applicant Address: JP Nagoya
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-277133 20071025
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
A circuit board is provided. The circuit board including a dielectric substrate; a ground electrode formed on the dielectric substrate; a radiation line formed on the dielectric substrate, at least a part of the radiation line including an open end and opposed to the ground electrode; a feeding line connected to the other end of the radiation line, the feeding line configured to feed high frequency signals to the radiation line or receive high frequency signals generated in the radiation line; a short-circuit line formed on the dielectric substrate and connected to the radiation line; a short-circuit element configured to short-circuit the short-circuit line and the ground electrode; and a connection terminal provided on the short-circuit line, wherein the connection terminal connects one end of the short-circuit element to the short-circuit line at a connection position and is configured so that the connection position is changeable.
Public/Granted literature
- US20090109100A1 Circuit board and telephone apparatus Public/Granted day:2009-04-30
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