Invention Grant
- Patent Title: Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure method, device manufacturing method
- Patent Title (中): 基板输送装置及基板输送方法,曝光装置及曝光方法,装置的制造方法
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Application No.: US11889288Application Date: 2007-08-10
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Publication No.: US08107055B2Publication Date: 2012-01-31
- Inventor: Atsushi Ohta , Takashi Horiuchi
- Applicant: Atsushi Ohta , Takashi Horiuchi
- Applicant Address: JP Katta-gun JP Tokyo
- Assignee: Zao Nikon Co., LTD.,Nikon Corporation
- Current Assignee: Zao Nikon Co., LTD.,Nikon Corporation
- Current Assignee Address: JP Katta-gun JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-349550 20031008
- Main IPC: G03B27/32
- IPC: G03B27/32

Abstract:
A method of pattern forming includes forming a resist film on a substrate, transferring a pattern onto the resist film by an immersion lithography method using a liquid immersion fluid to form a latent image on the resist film, conducting a first inspection to inspect whether or not the liquid immersion fluid remains on the resist film after said forming the latent image, developing the resist film after the first inspection, and performing predetermined processing when residual of the liquid immersion fluid is found in the first inspection.
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