Invention Grant
US08107200B2 ESD, cross talk and noise minimizing resistive/capacitative shunt for CPP and TMR devices
有权
ESD,串扰和噪声最小化CPP和TMR器件的电阻/电容分流
- Patent Title: ESD, cross talk and noise minimizing resistive/capacitative shunt for CPP and TMR devices
- Patent Title (中): ESD,串扰和噪声最小化CPP和TMR器件的电阻/电容分流
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Application No.: US12214504Application Date: 2008-06-19
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Publication No.: US08107200B2Publication Date: 2012-01-31
- Inventor: Eric Cheuk Wing Leung , Anthony Wai Yuen Lai , Pak Kin Wong , David Hu , Moris Dovek , Rod Lee
- Applicant: Eric Cheuk Wing Leung , Anthony Wai Yuen Lai , Pak Kin Wong , David Hu , Moris Dovek , Rod Lee
- Applicant Address: US CA Milpitas HK Shatin N.T.
- Assignee: Headway Technologies, Inc.,SAE Magnetics (HK) Ltd.
- Current Assignee: Headway Technologies, Inc.,SAE Magnetics (HK) Ltd.
- Current Assignee Address: US CA Milpitas HK Shatin N.T.
- Agency: Salie Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: G11B5/39
- IPC: G11B5/39

Abstract:
A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.
Public/Granted literature
- US20080259506A1 ESD, cross talk and noise pickup minimizing scheme for CPP and TMR devices Public/Granted day:2008-10-23
Information query
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