A mounting structure includes: an electronic component including: a functional element having a predetermined function; a first resin protrusion section having a surface covered by a covering film including a conductive section electrically connected to the functional element; and a second resin protrusion section that is disposed inside an area surrounded by the first resin protrusion section, and has adhesiveness at least on a surface of the second resin protrusion section, and a base member having a connection electrode and adapted to mount the electronic component. In the structure, the second resin protrusion section mounts the electronic component on the base member in a condition in which the conductive section of the covering film has conductive contact with the connection electrode due to elastic deformation of the first resin protrusion section.