A method of failure detection of an integrated circuit (IC) layout includes determining a critical path distance between a first geometric feature of the IC layout and a second geometric feature of the IC layout; and comparing the determined critical path distance to a defined minimum critical path distance between the first and second geometric features, wherein the defined minimum critical path distance corresponds to a desired electrical property of the IC layout, independent of any geometric-based ground rule minimum distance for the IC layout; identifying any determined critical path distances that are less than the defined minimum critical path distance as a design violation; and modifying the IC layout by eliminating the identified design violations.