Invention Grant
- Patent Title: Validation of electrical performance of an electronic package prior to fabrication
- Patent Title (中): 在制造前验证电子封装的电气性能
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Application No.: US12203955Application Date: 2008-09-04
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Publication No.: US08108811B2Publication Date: 2012-01-31
- Inventor: Timothy W. Budell , Patrick H. Buffett , Craig P. Lussier
- Applicant: Timothy W. Budell , Patrick H. Buffett , Craig P. Lussier
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Wenjie Li
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An electrical resistance determination method. Input to the method includes a description of at least one electrical network within a substrate. The description includes specification of a plurality of first ports on a first side of the substrate, and a plurality of second ports on a second side of the substrate, for each electrical network. All of the first ports are electrically isolated from one another. All of the second ports are electrically connected to a common voltage. A computer readable program code, which is executed by a processor of a computer system computes for a first electrical network of the at least one electrical network an electrical resistance between each first port and a port of the second ports. The computer code may also display a perspective plot of the computed electrical resistances as a bar oriented about normal to each first port.
Public/Granted literature
- US20080320424A1 VALIDATION OF ELECTRICAL PERFORMANCE OF AN ELECTRONIC PACKAGE PRIOR TO FABRICATION Public/Granted day:2008-12-25
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