Invention Grant
- Patent Title: Dummy metal insertion processing method and apparatus
- Patent Title (中): 虚拟金属插入处理方法和装置
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Application No.: US12337350Application Date: 2008-12-17
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Publication No.: US08108814B2Publication Date: 2012-01-31
- Inventor: Izumi Nitta
- Applicant: Izumi Nitta
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2008-119080 20080430
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50

Abstract:
A method includes: before carrying out a timing verification processing of a semiconductor circuit, preliminarily superposing and arranging a dummy pattern template representing an arrangement pattern of dummy metal, onto a layout area defined by layout data while changing an origin position of the dummy pattern template to optimize the origin position of the dummy pattern template; and upon detecting that the result of the timing verification processing has no problem, superposing and arranging the dummy pattern template onto the layout area at the origin position of the dummy pattern template, to generate the layout data after inserting the dummy metal.
Public/Granted literature
- US20090276745A1 DUMMY METAL INSERTION PROCESSING METHOD AND APPARATUS Public/Granted day:2009-11-05
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