Invention Grant
- Patent Title: Particle removing member of substrate processing equipment
- Patent Title (中): 基板加工设备的颗粒去除构件
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Application No.: US11063546Application Date: 2005-02-24
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Publication No.: US08108960B2Publication Date: 2012-02-07
- Inventor: Koichi Hashimoto , Yoshio Ota
- Applicant: Koichi Hashimoto , Yoshio Ota
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2004-050028 20040225
- Main IPC: B08B7/00
- IPC: B08B7/00

Abstract:
The present invention intends to provide a particle removing member of a substrate processing equipment which can be assuredly conveyed into the substrate processing equipment and can conveniently and assuredly remove an adhered foreign matter, and a particle removing method of a substrate processing equipment that uses the particle removing member.A particle removing member of a substrate processing equipment comprising a particle removing layer in which a time necessary for a signal intensity of free induction decay measured by a pulse NMR-Solid Echo method to decay to 37% of an initial value at a measurement temperature of 100 degrees centigrade is 1000 μs or less, in particular, a particle removing sheet comprising the above-constituted particle removing layer on a support, and a conveying member with particle removing function formed by adhering the above-constituted particle removing sheet on the conveying member, and furthermore a method of removing particle of a substrate processing equipment, comprising conveying the above-constituted conveying member with particle removing function into a substrate processing equipment.
Public/Granted literature
- US20050186428A1 Particle removing member of substrate processing equipment Public/Granted day:2005-08-25
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