Invention Grant
US08108984B2 Method for manufacturing integrated circuit inductors having slotted magnetic material
有权
具有开槽磁性材料的集成电路电感器的制造方法
- Patent Title: Method for manufacturing integrated circuit inductors having slotted magnetic material
- Patent Title (中): 具有开槽磁性材料的集成电路电感器的制造方法
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Application No.: US12406512Application Date: 2009-03-18
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Publication No.: US08108984B2Publication Date: 2012-02-07
- Inventor: Donald S. Gardner , Gerhard Schrom , Peter Hazucha , Fabrice Paillet , Tanay Karnik
- Applicant: Donald S. Gardner , Gerhard Schrom , Peter Hazucha , Fabrice Paillet , Tanay Karnik
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak, PLLC
- Main IPC: H01F7/06
- IPC: H01F7/06
Abstract:
Methods of manufacture of integrated circuit inductors having slotted magnetic material will be described. The methods may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers.
Public/Granted literature
- US20090207576A1 SLOTTED MAGNETIC MATERIAL FOR INTEGRATED CIRCUIT INDUCTORS Public/Granted day:2009-08-20
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