Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.