Invention Grant
- Patent Title: Packaging for downhole pressure transducers
- Patent Title (中): 井下压力传感器的包装
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Application No.: US12335545Application Date: 2008-12-16
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Publication No.: US08109143B2Publication Date: 2012-02-07
- Inventor: Wei-Heong Tan , Noriyuki Matsumoto
- Applicant: Wei-Heong Tan , Noriyuki Matsumoto
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent Daryl Wright; Jody DeStefanis; Jeff Griffin
- Main IPC: G01D11/24
- IPC: G01D11/24

Abstract:
Methods and related systems are described for a sealed housing for downhole transducers. The housing system includes a housing body and a transducer positioned within the housing body, and one or more flexible members sealably mounted on the housing body. The flexible members each have one or more undulations which facilitate movement of the flexible member in directions primarily perpendicular to the surface of the flexible member. The dimensions of the one or more undulations are designed so as to optimize the ability of the movements of the member thereby accommodating volume changes in the sealed housing. A substantial amount of compensating material can also be positioned within the housing body. The compensating material has a coefficient of thermal expansion substantially less than that of the housing material.
Public/Granted literature
- US20100147083A1 PACKAGING FOR DOWNHOLE PRESSURE TRANSDUCERS Public/Granted day:2010-06-17
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