Invention Grant
- Patent Title: Methods and apparatus to measure fluid flow rates
- Patent Title (中): 测量流体流速的方法和装置
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Application No.: US12390498Application Date: 2009-02-23
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Publication No.: US08109155B2Publication Date: 2012-02-07
- Inventor: Akira Otsuka
- Applicant: Akira Otsuka
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent Daryl R. Wright; Jody DeStefanis; Jeff Griffin
- Main IPC: G01F1/708
- IPC: G01F1/708 ; E21B47/10

Abstract:
Example methods and apparatus to measure fluid flow rates are disclosed. A disclosed example apparatus includes a circulator to selectively circulate a fluid in a flowline, a generator thermally coupled to the flowline at a first location and controllable to form a heat wave in the fluid, a sensor thermally coupled to the flowline at a second location to measure a first value representative of the heat wave, a phase detector to determine a second value representative of a wavelength of the heat wave based on the first value, a frequency adjuster to control the generator to form the heat wave in the fluid at a first frequency, the first frequency selected so that the second value is substantially equal to a distance between the first and second locations, and a flow rate determiner to determine a flow rate of the fluid based on the first frequency.
Public/Granted literature
- US20100212889A1 METHODS AND APPARATUS TO MEASURE FLUID FLOW RATES Public/Granted day:2010-08-26
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