Invention Grant
- Patent Title: Method for cutting protective tape of semiconductor wafer and protective tape cutting device
- Patent Title (中): 切割半导体晶片保护带和保护带切割装置的方法
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Application No.: US12272586Application Date: 2008-11-17
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Publication No.: US08109185B2Publication Date: 2012-02-07
- Inventor: Masayuki Yamamoto , Yukitoshi Hase , Yasuji Kaneshima
- Applicant: Masayuki Yamamoto , Yukitoshi Hase , Yasuji Kaneshima
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2007-304524 20071126
- Main IPC: B32B38/04
- IPC: B32B38/04
Abstract:
A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting movement of the cutter blade is once stopped, reversely moved to a initial piercing position, and thereafter, the cutter blade is moved towards the deep part of the notch from the other open end of the notch while being moved in a reverse direction with respect to the outer periphery of the wafer.
Public/Granted literature
- US20090133551A1 METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTECTIVE TAPE CUTTING DEVICE Public/Granted day:2009-05-28
Information query
