Invention Grant
US08109321B2 Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
有权
模块化散热器组件包括与较小的附加浮动散热器部件热连接的更大的主散热器部件
- Patent Title: Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
- Patent Title (中): 模块化散热器组件包括与较小的附加浮动散热器部件热连接的更大的主散热器部件
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Application No.: US12043078Application Date: 2008-03-05
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Publication No.: US08109321B2Publication Date: 2012-02-07
- Inventor: Sinan Alousi , Daniel Anav , Joseph D. Griffin , Ali Mira , Michael Mira , Henry Schrader
- Applicant: Sinan Alousi , Daniel Anav , Joseph D. Griffin , Ali Mira , Michael Mira , Henry Schrader
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: Duft Bornsen & Fishman LLP
- Main IPC: F28F7/02
- IPC: F28F7/02
Abstract:
A modular heat sink assembly is disclosed. The heat sink assembly includes a main (larger) heat sink member having one or more voids through the member. The heat sink assembly also includes one or more additional (smaller) heat sink members that fit within the voids of the main heat sink member and are able to move (float) within the voids while thermally connected to main heat sink member. The thermal connection to the main heat sink member may be accomplished by incorporating heat pipes as a bridge between the heat sink members, so that heat spreading, and regulation thereof, occurs over the additional heat sink members and the main heat sink member.
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