Invention Grant
- Patent Title: Heat plate type cooler module
- Patent Title (中): 热板式冷却器模块
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Application No.: US12134190Application Date: 2008-06-06
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Publication No.: US08109322B2Publication Date: 2012-02-07
- Inventor: Tsung-Hsien Huang
- Applicant: Tsung-Hsien Huang
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW97115667A 20080429
- Main IPC: F28F7/00
- IPC: F28F7/00

Abstract:
A heat plate type cooler module includes a heat plate, which is formed of a bottom cover plate and a top cover plate and having a working fluid filled in a vacuum chamber between the top cover plate and the bottom cover plate; heat pipes each having a cold end and a top end; a locating plate covered on the heat plate to hold the hot end of each heat pipe in contact with the heat plate; and radiation fins fastened to the cold ends of the heat pipe by press-fitting.
Public/Granted literature
- US20090266518A1 HEAT PLATE TYPE COOLER MODULE Public/Granted day:2009-10-29
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