Invention Grant
- Patent Title: Heat dissipation device having a clip
- Patent Title (中): 具有夹子的散热装置
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Application No.: US12409502Application Date: 2009-03-24
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Publication No.: US08109323B2Publication Date: 2012-02-07
- Inventor: Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
- Applicant: Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810068323 20080704
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; F28D15/00
Abstract:
A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
Public/Granted literature
- US20100000716A1 HEAT DISSIPATION DEVICE HAVING A CLIP Public/Granted day:2010-01-07
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