Invention Grant
US08109324B2 Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
有权
具有微封装相变材料的微通道热交换器用于高通量冷却
- Patent Title: Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling
- Patent Title (中): 具有微封装相变材料的微通道热交换器用于高通量冷却
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Application No.: US11105716Application Date: 2005-04-14
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Publication No.: US08109324B2Publication Date: 2012-02-07
- Inventor: Mohammed Mehdi Farid , Said Al-Hallaj
- Applicant: Mohammed Mehdi Farid , Said Al-Hallaj
- Applicant Address: US IL Chicago
- Assignee: Illinois Institute of Technology
- Current Assignee: Illinois Institute of Technology
- Current Assignee Address: US IL Chicago
- Agency: Pauley Petersen & Erickson
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; F28D15/00
Abstract:
A microchannel cooler containing a slurry having a particulate liquid/solid phase change material is provided balancing the interdependent factors of microencapsulated particle size with microchannel size and shape and flow conditions for the removal of high heat flux with low space and low power requirements.
Public/Granted literature
- US20060231233A1 Microchannel heat exchanger with micro-encapsulated phase change material for high flux cooling Public/Granted day:2006-10-19
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