Invention Grant
- Patent Title: Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
- Patent Title (中): 将焊料粉末附着到电子电路板和焊接电子电路板的方法
-
Application No.: US12013246Application Date: 2008-01-11
-
Publication No.: US08109432B2Publication Date: 2012-02-07
- Inventor: Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
- Applicant: Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-201567 20050711
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
Public/Granted literature
Information query
IPC分类:
