Invention Grant
- Patent Title: Chassis with rubber pads
- Patent Title (中): 带橡胶垫的底盘
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Application No.: US12631849Application Date: 2009-12-06
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Publication No.: US08109486B2Publication Date: 2012-02-07
- Inventor: Bin Gong , Ming-Chang Lee
- Applicant: Bin Gong , Ming-Chang Lee
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910308379 20091016
- Main IPC: F16M13/00
- IPC: F16M13/00

Abstract:
A chassis includes a base body and a rubber pad. The base body includes a bottom plate and a side plate perpendicular to the bottom plate. A mounting portion is defined in a junction portion of the bottom plate and the side plate. The rubber pad includes a resisting portion and a clamping portion perpendicularly extending from the resisting portion. The rubber pad is detachably received in the mounting portion, with the resisting portion locking with the side plate and the clamping portion engaging with the bottom plate.
Public/Granted literature
- US20110089299A1 CHASSIS WITH RUBBER PADS Public/Granted day:2011-04-21
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