Invention Grant
- Patent Title: Fluid ejector structure and fabrication method
- Patent Title (中): 流体喷射器结构和制造方法
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Application No.: US12205709Application Date: 2008-09-05
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Publication No.: US08109607B2Publication Date: 2012-02-07
- Inventor: Chien-Hua Chen , Martha A Truninger , Michael Monroe , Steven R Geissler
- Applicant: Chien-Hua Chen , Martha A Truninger , Michael Monroe , Steven R Geissler
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/135
- IPC: B41J2/135
Abstract:
In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.
Public/Granted literature
- US20090225131A1 Fluid Ejector Structure and Fabrication Method Public/Granted day:2009-09-10
Information query
IPC分类:
