Invention Grant
- Patent Title: Micro-fluid ejection head and stress relieved orifice plate therefor
- Patent Title (中): 微流体喷头和应力释放孔板
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Application No.: US11867205Application Date: 2007-10-04
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Publication No.: US08109608B2Publication Date: 2012-02-07
- Inventor: Bryan Thomas Fannin , Vinod Kumar Gopalakrishnan , Christopher John Money , Sean Terrence Weaver
- Applicant: Bryan Thomas Fannin , Vinod Kumar Gopalakrishnan , Christopher John Money , Sean Terrence Weaver
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: B41J2/135
- IPC: B41J2/135 ; B41J2/15 ; B28B1/48

Abstract:
A micro-fluid ejection head and methods for improving the fabrication and operation of the micro-fluid ejection head. The ejection head includes a photoimaged thick film layer attached to a substrate containing fluid ejection actuators. An orifice plate is laminated to the thick film layer. The orifice plate has a plurality of concentric orifices therein and is derived from a first photoresist material that is heated to a temperature sufficient to relieve film stresses in the photoresist material prior to exposing and developing the orifices in the orifice plate.
Public/Granted literature
- US20090091600A1 MICRO-FLUID EJECTION HEAD AND STRESS RELIEVED ORIFICE PLATE THEREFOR Public/Granted day:2009-04-09
Information query
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