Invention Grant
- Patent Title: Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head
- Patent Title (中): 布线基板，布线基板的制造方法以及液滴喷射头
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Application No.: US11510591Application Date: 2006-08-28
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Publication No.: US08109612B2Publication Date: 2012-02-07
- Inventor: Toshiya Kojima , Gentaro Furukawa
- Applicant: Toshiya Kojima , Gentaro Furukawa
- Applicant Address: JP Tokyo
- Assignee: Fujifilm CORPORATION
- Current Assignee: Fujifilm CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-247743 20050829
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/045
Abstract:
The wiring substrate having a recess section and a projecting section formed on at least one surface of the wiring substrate, and wires formed on both the recess section and the projecting section.
Public/Granted literature
- US20070049130A1 Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head Public/Granted day:2007-03-01
Information query
IPC分类:
