Invention Grant
- Patent Title: LED assembly
- Patent Title (中): LED组装
-
Application No.: US12400923Application Date: 2009-03-10
-
Publication No.: US08109652B2Publication Date: 2012-02-07
- Inventor: Ya-Huei Chen
- Applicant: Ya-Huei Chen
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: TW97205526U 20080401; TW97209964U 20080606
- Main IPC: F21S4/00
- IPC: F21S4/00 ; F21V21/005 ; F21V21/34

Abstract:
An improved LED assembly comprises a frame and a circuit substrate. The frame has a slot, which has an opening on the upper surface of the frame. An elongated inverted L-shaped structure is formed on either side of the opening, and one or more conductive strips are formed on the inner side of the elongated inverted L-shaped structure. Therefore, electricity may be supplied to the conductive strips of the frame. In assembly, the circuit substrate is slid into the slot of the frame so that each of the conductive strips of the circuit substrate is engaged with the corresponding conductive strip of the frame. Therefore, electricity from the electric source may be fed from the source through the conductive strip of the frame and the conductive strip of the circuit substrate and then to the light-emitting units so that each of the light-emitting units may be powered up.
Public/Granted literature
- US20090244909A1 LED Assembly Public/Granted day:2009-10-01
Information query